Components and Subsystems

SMPS Capacitors

High speed Switch Mode Power Supply (SMPS) capacitors by API offer lower Equivalent Series Resistance (ESR), lower Equivalent Series Inductance (ESL), lower ripple voltage, and less self heating compared to other capacitive elements.

Planar Capacitors

API designs and manufactures a wide range of planar capacitor arrays that offer many advantages over stand-alone chip, discoidal or tubular capacitors:  they are low profile, compact, and have quick assembly time.

Discoidal Capacitors

API's discoidal capacitors provide great versatility in meeting varied voltage, capacitance and dimensional requirements and are ideally suited for by-pass and filtering applications.

Tubular Capacitors

API manufactures a wide variety of tubular ceramic capacitors, which are small in size, lightweight, non-polar and offer high dielectric strength and impervious to moisture and contamination.

Filtered Circular Connectors

API offers a premium line of custom and specialty filtered connectors. These custom high reliability, circular connectors have a reputation for superior quality and performance.

Filtered Audio Connectors

API's custom filtered audio connectors provide effective EMI filtering and meet all the requirements of MIL-STD-810F including sand and dust, salt, fog, high altitude operation, fungus resistance and immersion to 20 meters.

Filtered Rapid Mate Connectors

API Rapid Mate Connectors provide the ease and reliability of hot shoe style mating with the added benefit of integral filtering.

Specialty Unfiltered Connectors

API offers unfiltered custom connector design and manufacturing to meet the mechanical and environmental specifications of similar QPL connectors or to the requirements of your custom system.

Aqueous Cleaning and Sealing

API uses the Aquastorm cleaning system, providing a unique impingement pattern; cleaning even the most challenging flux residues.

Die Bonding & Glob Top Dispensing

API  offers Primary Encapsulation, or Glob Top Dispensing, a Build to Print technique where a specific amount of resin is deposited over an open chip and its wire bonds.

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