Thin Film

API's Thin Film Technology includes a vaiety of metallization options, plated through Vias, plated through holes, polyimide bridges and dams, and TaN and NiChrome resistors to meet all your thin film needs.

Aqueous Cleaning and Sealing

API uses the Aquastorm cleaning system, providing a unique impingement pattern; cleaning even the most challenging flux residues.

Die Bonding & Glob Top Dispensing

API  offers Primary Encapsulation, or Glob Top Dispensing, a Build to Print technique where a specific amount of resin is deposited over an open chip and its wire bonds.

Automated Element Attach

API's Build to Print Automated Element Attach capabilities focus on the same high quality process control that our ISO 9001:2000 certification demands.

Automated PCB Assembly

API's ability to achieve total vertical integration draws its success from our diverse group of more than 35 engineers dedicated to specialized areas of expertise such as microwave, electrical, process and mechanical.

Fluxless Soldering

Build to Print Fluxless Soldering by API, removes oxides from substrates and inhibits further oxidation insuring both intimate substrate-to-alloy contact and a secure bond.

Die Attach

API’s  void-free precision millimeter-wave bonding techniques maintains maximum die-to-substrate surface contact eliminating poor signal propagation found in less sophisticated semiconductor or MMIC die attachment methods.

Wire Bonding

API specializes in Wirebonding whether it be Automatic Gold Ball Bonding or Automatic Aluminum Wedge Bonding.  API also offers premier manual wire bonding using dependable wire ribbon techniques which other companies fail to include in their line-up.

Assemblies & Applications

API's vast knowledge, and experience, in advanced computer simulation, allowing us the ability to manufacture custom solutions and military hardened assemblies for any of your antenna assembly needs.

Wi-Fi Pro Dual Band Antennas

API has years of experience in the art and science of RF engineering, electrical engineering, materials science and state-of-the-art manufacturing and designs and builds custom application-specific antennas and antenna systems to meet specific customer needs.

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Recent Events

June 19, 2017 - June 21, 2017
Street:
Baltimore Convention Center & Hilton Hotel
City:
Baltimore
,
Province:
Maryland
Country:
United States
The Information Assurance Symposium (IAS) will take place from 19th June to the 21st June 2017 at the Baltimore Convention Center & Hilton Hotel. IAS is the premier NSA information assurance event, providing an opportunity for guests to learn and network from cyber security professionals, subject matter experts and solution providers from throughout Government, industry and academia.
June 4, 2017 (All day) - June 9, 2017 (All day)
City:
Honolulu
,
Province:
Hawaii
Country:
United States
The IEEE MTT International Microwave Symposium (IMS) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as numerous social events and networking opportunities. The symposium also hosts a large commercial exhibition. Co-located with IMS are the IEEE RFIC and ARFTG conferences.