Phase Locked Oscillators

A Phase Locked Oscillator must be compatible with other components in the system and must operate properly within complex systems. Knowing this, API engineers have reviewed power supply noise, load impedances, and other considerations to create a design that will be successful during full integration.

Synthesizers

API’s synthesizers offer wide bandwidth, multiple step size options, fast switching speed, and low phase noise combined with the cost advantages of standardized packages. Frequency control options include: Serial/parallel inputs, BCD/Binary format, or traditional thumbwheel switches.

API Technologies Reports Results for Three and Six Months Ended November 30, 2011

ORLANDO, FL - (PRNewswire) - February 9, 2012 - API Technologies Corp. (NASDAQ:ATNY) (“API”, “API Technologies”, or the “Company”), a provider of electronic systems, subsystems, RF, and secure solutions for the defense, aerospace, and commercial industries, today announced results for the three and six months ended November 30, 2011. This is a transition reporting period, with the fiscal year henceforth ending November 30.

Thin Film

API's Thin Film Technology includes a vaiety of metallization options, plated through Vias, plated through holes, polyimide bridges and dams, and TaN and NiChrome resistors to meet all your thin film needs.

Aqueous Cleaning and Sealing

API uses the Aquastorm cleaning system, providing a unique impingement pattern; cleaning even the most challenging flux residues.

Die Bonding & Glob Top Dispensing

API  offers Primary Encapsulation, or Glob Top Dispensing, a Build to Print technique where a specific amount of resin is deposited over an open chip and its wire bonds.

Automated Element Attach

API's Build to Print Automated Element Attach capabilities focus on the same high quality process control that our ISO 9001:2000 certification demands.

Automated PCB Assembly

API's ability to achieve total vertical integration draws its success from our diverse group of more than 35 engineers dedicated to specialized areas of expertise such as microwave, electrical, process and mechanical.

Fluxless Soldering

Build to Print Fluxless Soldering by API, removes oxides from substrates and inhibits further oxidation insuring both intimate substrate-to-alloy contact and a secure bond.

Die Attach

API’s  void-free precision millimeter-wave bonding techniques maintains maximum die-to-substrate surface contact eliminating poor signal propagation found in less sophisticated semiconductor or MMIC die attachment methods.

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