Rework & Troubleshooting

Sometimes the rework of existing PCB assemblies is necessary to fix a design flaw, upgrade an assembly with new components, or it is simply a cost-effective solution to building from scratch. API’s rework specialists assure that the resulting PCBs and assemblies meet the highest quality standards. 

Featured capabilities:

Prediction & Elimination of Problems
API leverages state-of-the-art software to render a virtual board build. In a matter of minutes, API can spot engineering mistakes, check electrical clearances, review it against standards, check component sizes, and much more.

Test Engineering

Our experienced electrical engineers and technicians excel at working with customers to develop methodologies and design fixtures to reduce overall manufacturing costs, improve production yields, identify failures early, support root cause analysis, and assist engineering with DFT (Design For Test) analysis.

Supply Chain Management

When it comes to Supply Chain Management, API understands that you need to keep your inventory levels low to control costs, yet still need to respond quickly to new orders to satisfy your customers. API customers leverage our supply chain management expertise to receive high quality products without a high inventory risk. We are able to customize our stocking and logistics programs to meet your production needs and reduce your inventory exposure from prototypes all the way through high volume production orders.

Next Steps

Electronics Assembly

API offers a wide range of services supporting PCB assembly, box build (PCB subassembly or final product assembly), electromechanical assembly and full turnkey production. Manufacturing capabilities include:

  • High Speed SMT Board Assembly, Single and Double Sided 
  • Fine Pitch 0201 Component Placement 
  • BGA & Micro-BGA (Ball Grid Array) 
  • RoHS Compliant Assembly 
  • Mixed Technologies (SMT and Through-Hole) 
  • Box Build (Subassembly or Final Product Assembly) 
  • Electromechanical Assembly 
  • 100% Material Procurement, 100% Consigned Material Management, or a Mix of Both 
  • Dedicated Program Management
  • In-process and Post-Assembly Verification (AOI, X-ray, Flying Probe, Functional and In-circuit Test) 

Design Engineering

Our award-winning team can We can help you deliver a higher quality product to your customers at lower total cost by optimizing existing designs for streamlined production. Our engineers can also oversee your product from concept to completion, incorporating DFM/DFA/DFT (design for manufacturability / design for assembly / design for test) principles in the early design stages to assure seamless production.

 

Next Steps

 

Power Solutions for Military

The company is a leading designer and manufacturer of MIL-STD-810 and MIL-STD-461 compliant power products. Compact, efficient and rugged, products from API are designed to meet demanding military and federal IT requirements. 

Explore our featured products:

Build to Print

API’s expertise covers state-of-the-art microelectronic techniques and technologies including:

  • Micro BGAs
  • Die bonding
  • Fluxless DAP Soldering
  • 1-3 mil Gold Ball Bonding
  • Automatic wedge bonding
  • Automated PCB assembly
  • In-house thin film fabrication
  • Fully automated over temperature testing

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Thin Film Technology

With over four decades of sputtering experience, API is the premier choice for thin film metallization solutions.

Besides standard metals like Gold, Nickel and Titanium Tungsten, we are also specialists in a number of exotic metals including:

  • Platinum
  • Chromium
  • Palladium
  • Aluminum
  • Silver
  • Copper

API's advanced sputtering systems can accomodate wafers as large as 12", and we are not limited by even the largest size wafer requirements.

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RF Components

API offers a wide array of RF Components to fit a number of specialized needs.  Our products include:

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Recent Events

June 19, 2017 - June 21, 2017
Street:
Baltimore Convention Center & Hilton Hotel
City:
Baltimore
,
Province:
Maryland
Country:
United States
The Information Assurance Symposium (IAS) will take place from 19th June to the 21st June 2017 at the Baltimore Convention Center & Hilton Hotel. IAS is the premier NSA information assurance event, providing an opportunity for guests to learn and network from cyber security professionals, subject matter experts and solution providers from throughout Government, industry and academia.
June 4, 2017 (All day) - June 9, 2017 (All day)
City:
Honolulu
,
Province:
Hawaii
Country:
United States
The IEEE MTT International Microwave Symposium (IMS) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as numerous social events and networking opportunities. The symposium also hosts a large commercial exhibition. Co-located with IMS are the IEEE RFIC and ARFTG conferences.