Products.

EMS - Defense

API Technologies has over 35 years experience in Circuit Card Assembly (CCA), Subassembly, and Final Product Assembly for the military and aerospace industries. From quick-turn prototypes to high-mix low to medium volume production runs—API CCA manufacturing is a reliable, cost-effective solution for your outsourcing needs.

With state-of-the-art equipment and a workforce skilled in the demands of mission-critical applications, our multiple on-shore facilities are certified to manufacture to military, space, and DoD requirements.

Certifications:

  • MIL-PRF-38534 (H & K)
  • J-STD-001
  • ISO 9001:2008
  • AS-9100 & AS-9100, Rev C
  • IPC-A-610, Class III & Class II
  • NASA-STD-8379
  • ANSI 20.20
  • RoHS Compliant
  • US Department of State ITAR Registered

Recent Events

June 10, 2018 (All day) - June 15, 2018 (All day)
City:
Philadelphia
,
Province:
Pennsylvania
Country:
United States
The IEEE MTT International Microwave Symposium (IMS) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as numerous social events and networking opportunities. The symposium also hosts a large commercial exhibition. Co-located with IMS are the IEEE RFIC and ARFTG conferences.
May 30, 2018 (All day) - May 31, 2018 (All day)
Street:
4899 Uplands Drive
City:
Ottawa
,
Province:
Ontario
Country:
Canada
Join the Emcon team at CANSEC 2018 as they showcase the latest developments in TEMPEST, rugged, and high security IT solutions for the government marketplace. CANSEC is Canada’s annual Defence exhibition taking place at the EY Centre in Ottawa. CANSEC is Canada's foremost defence technology showcase. A two-day event, CANSEC will feature 120,000 square feet of indoor exhibits by Canada's leading edge defence and security companies, as well as an outdoor static display. This showcase targets a wide audience of customers that includes Government agencies and departments with an interest in the defence sector.

Manufacturing Capabilities

Testing Capabilities

Multiple SMT Lines
Automated Optical Inspection (AOI)
BGA and micro-BGA (0.5mm)
X-Ray
Chip-on-Board, Wire-Bonding, and Flip-Chip
Flying Probe
Leaded and Lead-free
In-Circuit & Functional
Double-Sided and Thru-Hole
System Testing
Fine Pitch (0201 & 01005)
Thermal & Vibrational
Conformal Coating (AR, UR, SR)
PCB Cross-Sectioning
Thick/Thin Film

BGA Re-Work

BGA Re-Balling Specialists