Products.

EMS - Defense

API Technologies has over 35 years experience in Circuit Card Assembly (CCA), Subassembly, and Final Product Assembly for the military and aerospace industries. From quick-turn prototypes to high-mix low to medium volume production runs—API CCA manufacturing is a reliable, cost-effective solution for your outsourcing needs.

With state-of-the-art equipment and a workforce skilled in the demands of mission-critical applications, our multiple on-shore facilities are certified to manufacture to military, space, and DoD requirements.

Certifications:

  • MIL-PRF-38534 (H & K)
  • J-STD-001
  • ISO 9001:2008
  • AS-9100 & AS-9100, Rev C
  • IPC-A-610, Class III & Class II
  • NASA-STD-8379
  • ANSI 20.20
  • RoHS Compliant
  • US Department of State ITAR Registered

Recent Events

June 19, 2017 - June 21, 2017
Street:
Baltimore Convention Center & Hilton Hotel
City:
Baltimore
,
Province:
Maryland
Country:
United States
The Information Assurance Symposium (IAS) will take place from 19th June to the 21st June 2017 at the Baltimore Convention Center & Hilton Hotel. IAS is the premier NSA information assurance event, providing an opportunity for guests to learn and network from cyber security professionals, subject matter experts and solution providers from throughout Government, industry and academia.
June 4, 2017 (All day) - June 9, 2017 (All day)
City:
Honolulu
,
Province:
Hawaii
Country:
United States
The IEEE MTT International Microwave Symposium (IMS) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as numerous social events and networking opportunities. The symposium also hosts a large commercial exhibition. Co-located with IMS are the IEEE RFIC and ARFTG conferences.

Manufacturing Capabilities

Testing Capabilities

Multiple SMT Lines
Automated Optical Inspection (AOI)
BGA and micro-BGA (0.5mm)
X-Ray
Chip-on-Board, Wire-Bonding, and Flip-Chip
Flying Probe
Leaded and Lead-free
In-Circuit & Functional
Double-Sided and Thru-Hole
System Testing
Fine Pitch (0201 & 01005)
Thermal & Vibrational
Conformal Coating (AR, UR, SR)
PCB Cross-Sectioning
Thick/Thin Film

BGA Re-Work

BGA Re-Balling Specialists