Products.

Electronics Assembly

API offers a wide range of services supporting PCB assembly, box build (PCB subassembly or final product assembly), electromechanical assembly and full turnkey production. Manufacturing capabilities include:

  • High Speed SMT Board Assembly, Single and Double Sided 
  • Fine Pitch 0201 Component Placement 
  • BGA & Micro-BGA (Ball Grid Array) 
  • RoHS Compliant Assembly 
  • Mixed Technologies (SMT and Through-Hole) 
  • Box Build (Subassembly or Final Product Assembly) 
  • Electromechanical Assembly 
  • 100% Material Procurement, 100% Consigned Material Management, or a Mix of Both 
  • Dedicated Program Management
  • In-process and Post-Assembly Verification (AOI, X-ray, Flying Probe, Functional and In-circuit Test) 

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Recent Events

June 19, 2017 - June 21, 2017
Street:
Baltimore Convention Center & Hilton Hotel
City:
Baltimore
,
Province:
Maryland
Country:
United States
The Information Assurance Symposium (IAS) will take place from 19th June to the 21st June 2017 at the Baltimore Convention Center & Hilton Hotel. IAS is the premier NSA information assurance event, providing an opportunity for guests to learn and network from cyber security professionals, subject matter experts and solution providers from throughout Government, industry and academia.
June 4, 2017 (All day) - June 9, 2017 (All day)
City:
Honolulu
,
Province:
Hawaii
Country:
United States
The IEEE MTT International Microwave Symposium (IMS) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as numerous social events and networking opportunities. The symposium also hosts a large commercial exhibition. Co-located with IMS are the IEEE RFIC and ARFTG conferences.