API Technologies: Electronics Manufacturing Services (EMS)
Take a quick tour of API's Windber, PA facility and learn more about the company's Electronics Manufacturing Services for defense and commercial customers. Featured EMS capabilities include: Circuit Card Assembly (CCA), Surface Mount Technology (SMT), Printed Circuit Boards (PCB), Ball Grid Array (BGA) placement from .08 mil to highest I/O count, BGA rework, BGA troubleshooting, BGA replacement (including lead replacement for defense products), uBGA, 01005, 0201, Leadless chip, Ultra-fine pitch, New Product Introductions (NPI) / prototypes, High Mix Low Volume (HMLV) engagements, Low Mix High Volume (LMHV) engagements and Cable and Wire Harness. For more information on these and other API services, visit www.apitech,com or email email@example.com.
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