API Technologies' LTCC is an alternative glass-ceramic multilayer substrate medium that incorporates conventional thick-film-material metal systems, providing a rugged, cost competitive substrate that can incorporate embedded passive components, along with more advanced devices such as flipchips and wire bonded bare die.
Cavities can be configured in an LTCC substrate to provide controlled-impedance wire bond connections and high-reliability packaging solutions.
Contact us today for implementation guidance for selecting the appropriate substrate and component technology for your unique project requirements.
LTCC technology is extremely useful in a diverse range of applications, including high-volume automotive systems. It is becoming the technology of choice for high-frequency RF and microwave applications in the wireless and radar industries.
Passive components can be buried between the LTCC tape layers, minimizing the length of interconnects, improving integration and robustness, and further reducing circuit geometry. This capability is supported by continual substantial investment in fully automated production facilities to maintain the consistent levels of quality demanded by our customer's high reliability requirements.
Substrates manufactured using the cofired technique can be processed using the same methods as standard alumina substrates. Once they have been fired, laser trimmed and singulated they can be populated using standard surface mount and advanced
API Technologies offers a complete engineering, design, qualification and manufacturing service for modules and subsystems. Interconnect and assembly design is performed on advanced CAD/CAE workstations by experienced electronics engineers. Full electronic simulation is performed on analogue, digital , RF and Microwave and mixed mode circuits.
API Technologies has demonstrated capability up to 60GHz and power management of tens of watts of power with LTCC based technology and provides guidance on implementation of the most appropriate substrate and component technologies.
LTCC is best suited for applications that can take advantage of one or more of the following: