API is a designer and manufacturer of RF/microwave and hybrid components, RF/microwave, MMW, and microelectronic assemblies for defense, space systems, satellite, high-rel commercial, communications, avionics and ruggedized industrial applications, as well as high temperature, harsh environments. As your full-service partner for hybrid engineering and thermal design expertise, we are able to provide you with high performance products using state-of-the-art manufacturing processes coupled with the reliability and superior quality that today’s customers demand.
High-reliability thick film hybrids and multi-chip modules (MCMs) are API Technologies' core competence. From complex hermetically-sealed multi-chip-modules used in aerospace and defence applications, to high-volume automotive control modules, API Technologies' thick-film hybrids and MCMs are designed for maximum reliability in the harshest environments.
API has successfully tested its thick-film technology at 200 degrees centigrade and the company is introducing new thick-film systems which are capable of performing at 225 degrees centigrade.